Responsible on execution and analysis of NAND memory reliability qual and perform Failure Analysis.
Designing and developing reliability sequences for given technology node in addition to performing actual reliability test execution followed by Failure Analysis to root cause the issues reported.
Some of the other areas that this position will include will be: R&D support, DPPM improvement, test documentation, comprehension of design manuals and data sheets, using various bench equipment (oscilloscopes, logic analyzers, multimeter), and interacting with other engineering groups.
REQUIRED:
Master in Electrical/Electronics Engineering, Material Engineering or related Engineering field.
SKILLS:
Must have good troubleshooting and debug skills.
Ability to analyze complex problems, multi-task and meet deadlines.
NAND FLASH memory test background is helpful. Ability to understand failure analysis.
Excellent English communication (written and verbal) and interpersonal skills.
Good teamwork, willing to learn, logical thinking & ability to multitask.