6 CHANGI NORTH STREET 2 East Region (Singapore) Singapore
职位描述
岗位职责
Job responsibilities
Assembly and packaging process improvement and optimization in systematic manner
Documentation for key assembly and packaging processes, and implementation of effective process control practices to achieve repeatability of quality assembly process
Propose, evaluate and refine current process steps for yield and capacity improvements
Documentation and implementation of preventive and corrective action, and best-known methods to allow more efficient process troubleshooting
Qualification of new assembly and packaging related direct materials
Buyoff and release of new assembly and packaging equipment
Analyze process out of control and failures, and develop corrective actions accordingly
Monitor process performance and suggest improvements
Work with specialists/vendors to design and develop new process
Ensure compliance with ISO standards and support audit functions
Provide support for customer returns
Perform process qualification before handing off to production
Develop cost-reduction initiatives while still maintaining quality and productivity
Aligning and supporting packaging roadmaps, developing and optimizing processes to improve product quality and reliability
Working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems
Requirements
Degree in Mechanical Engineering / Material Science
Minimum 5 years’ working experience in semiconductor assembly and packaging process
Ideally with strong semiconductor assembly and packaging process experience and knowledge, deep understanding about processes such as wafer cleaving, die attachment (especially eutectic die attach), wire bonding, etc.
Strong skills in developing and refining process to enhance yield, reliability and efficiency, with vast hands-on experience in DOE (design of experiment) practice
Strong analytical skills to identify and resolve process issues effectively
Ability to develop long-term strategies for process improvement and innovation
Familiarity with industry standards and regulations related to semiconductor assembly and quality control
Ability to lead projects and work collaboratively with cross-functional teams
Able to mentor junior engineers and lead team in process improvement initiatives