- Singapore
工作地点
职位描述
岗位职责
Semiconductor Associate Engineer
Equipment | Die Prep | Molding | Pick & Place
OPEN POSITIONS
Equipment Associate Engineer
Die Preparation / Reconstruction
️ Process Associate Engineer – Die Preparation
Process Associate Engineer – Molding
Process Associate Engineer – Pick & Place
REQUIREMENT
Diploma or degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics, Materials Science or related disciplines
2–3 years of semiconductor manufacturing experience
Relevant backend process/equipment experience
Able to work rotating 12-hour shifts
Relevant Experience:
Backgrind • Dicing • Laser Grooving • Wafer Saw • Pick & Place • Molding • De-bonding
SHIFT SCHEDULE
Day: 8:30AM – 8:30PM
Night: 8:30PM – 8:30AM
Rotation every 3 months
BENEFITS
AWS • Performance Bonus • Medical & Dental • Insurance • Shift Allowance
Apply NOW! Share your resume to: *************
Only shortlisted candidate will be notified!
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