jobs in Lumilens

全职 Senior-Staff Process Engineer (Flip Chip) 工作, 薪水, Lumilens 公司招聘中 - Ricebowl

Senior-Staff Process Engineer (Flip Chip)

Lumilens

Undisclosed

全职

Singapore

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工作地点

  • Singapore

职位描述

岗位职责

Core Responsibilities

  • Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
  • DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.
  • Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.
  • Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
  • Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.
  • Manage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.
  • Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.

Key Requirements & Qualifications

  • Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.
  • Experience: 5+ years of hands-on industry experience in flip chip assembly.
  • Technical Knowledge:
  • Deep practical understanding of plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
  • Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity.
  • Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools.
  • Software Tools: High proficiency with robust analytical platforms like JMP, Minitab.

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