全职 Software Engineer 工作, 薪水 up to SGD 5,000, LINCSTECH CIRCUIT SINGAPORE PTE. LTD. East Region (Singapore) 公司招聘中 - Ricebowl

Responsibilities:

• Application Development: Architect, build, and maintain scalable back-end services and enterprise applications using .NET (C#) and Java (Spring Boot MVC)
• System Integration & Automation: Design and build reliable APIs, microservices, and workflow automations using Python and visual orchestration platforms (Dify or n8n)
• LLM & AI Integration: Leverage platforms like Dify or n8n to integrate enterprise AI capabilities, automated agent workflows, and internal tool chains
• Database & Performance Optimization: Write clean, efficient SQL/NoSQL queries, optimize database interactions, and ensure high system responsiveness and throughput
• Troubleshooting & Maintenance: Debug complex system issues, perform code reviews, and continually optimize performance, security, and scalability
• Collaboration: Partner with cross-functional teams (product managers, UI/UX designers, and systems engineers) to translate business requirements into technical solutions

Requirements:

Core Software Engineering

• Degree in Computer Science/Information & Communication Technology with 3 years of professional experience in software engineering and back-end development
• Strong proficiency in .NET / C# (ASP.NET Core framework, Web APIs)
• Hands-on experience with Java and the Spring Boot framework (Spring MVC, Data JPA, RESTful Web Services)
• Solid programming capability in Python for backend services, scripting, or data handling.

Workflow & AI Automation

• Experience with workflow automation and AI agent platforms such as Dify or n8n (e.g., building prompt workflows, RAG pipelines, API triggers, or agent integration).

Skill set

• Good communication skills, independent and team player
• Good problem-solving skills with minimal supervision
• Able to adapt in a fast-paced environment
• Fresh graduates are welcome as training will be provided

HITACHI CHEMICAL (SINGAPORE) PTE. LTD.

Manufacturer of Multi Layer Printed Wiring Boards