jobs in SILICON BOX PTE. LTD.

全职 Industrial Engineering Manager 工作, 薪水 up to SGD 10,000, SILICON BOX PTE. LTD. East Region (Singapore) 公司招聘中 - Ricebowl

Industrial Engineering Manager

SILICON BOX PTE. LTD.

SGD8,000 - SGD10,000 每月

Pasir Ris, East Region (Singapore)

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工作地点

  • Pasir Ris East Region (Singapore) Singapore

职位描述

岗位职责

Position Summary

IE Manager is responsible for plant capacity management and production floor layout management.

Candidates with experience in semiconductor manufacturing environment are encouraged to apply for this position.

Key Responsibilities

The IE Manager will build and lead a team to support the department various objectives in the following areas:

  • Analysis of manufacturing capacity and proper resource arrangement

  • Establish and maintain capacity model.

  • Plant shop floor layout optimization, including machine layouts in production line.

  • Production capacity planning

  • IE-related documentation

  • Team management and motivation

  • Cost modelling

  • Direct material usage control to drive cost reduction/tracking.

  • Machine UPH increment

  • Operation efficiency improvement by MODPATS (Modular Arrangement of Predetermined Time Standards) analysis

  • Other ad-hoc activities assigned by the management.

Requirement

  • Min Degree in Industrial Engineering or equivalent.

  • Min 8 years’ experience in semiconductor manufacturing environment or another related field.

  • Experience in team leadership and management.

  • Knowledge of semiconductor manufacturing process is an advantage.

  • Hand-on skills on CAD tools like AutoCAD.


Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.


We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.

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