jobs in ASE SINGAPORE PTE. LTD.

全职 Industrial Engineer 工作, 薪水 up to SGD 4,500, ASE SINGAPORE PTE. LTD. North Region (Singapore) 公司招聘中 - Ricebowl

Industrial Engineer

ASE SINGAPORE PTE. LTD.

SGD3,500 - SGD4,500 每月

Woodlands, North Region (Singapore)

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工作地点

  • Woodlands North Region (Singapore) Singapore

职位描述

岗位职责

Responsibilities

  • Conduct time studies to set precise standards for machine capacity and cycle time
  • Use data analytics platforms to ensure accurate production loading assessments and resource allocation
  • Collaborate with Operations and Engineering teams to drive OEE improvements
  • Initiate, analyze, plan, and execute reconfiguration projects to maximize tester utilization
  • Plan and manage testers and related hardware & software, overseeing transfer in/out activities and ensuring alignment with company goals
  • Maintain robust spare parts inventory and ensure availability and readiness for production needs

Requirements

  • Degree in Industrial Engineering, Electrical Engineering, Mechanical Engineering, or any related Engineering discipline
  • Proficient in Microsoft Office (Word, Excel, PowerPoint)
  • Strong analytical skills with a flair for numbers and data-driven decision-making
  • Excellent interpersonal and communication skills, both written and verbal
  • Ability to adapt to changing environments and manage multiple tasks efficiently
  • Ability to work well as a team player while being independent and proactive in problem-solving
  • Positive attitude, growth mindset, and eagerness to learn and develop new skills.
  • Exposure to manufacturing or production environments is a plus
  • Fresh graduates are welcome to apply

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.

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