全职 Senior Process Engineer ( Dicing- Grinding- LLO- Bonding) 工作, 薪水, OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang Kedah 公司招聘中 - Ricebowl

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on *************

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Your new responsibilities

• To sustain and optimize dicing/ grinding/ LLO/ Bonding process & equipment for continue improvement, countermeasures issue, ensuring tool maximum productivity, new product qualification & release.
• Support in develop and optimize dicing/ grinding / LLO/ Bomding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
• To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirement
• Interaction with Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process
• Drive continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ gridining / LLO/ Bonding area.
• Collaborate with counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST) for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.
• To support root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.
• Establishes control measures to ensure conformance to ISO/TS 16949, ISO 45001, ISO 14001, and other standards, while leading customer and certifying body audits.

What we look for

• Degree / Master in Electrical Engineering / Mechatronic / Mechanical / Chemical Engineering
• Preferably 5 years experience in manufacturing environment and min 5 years experience in dicing/ grinding / Laser Lift Off/ Bonding process engineering.
• Good in presentation and communication
• Fluency in English and Bahasa Malaysia

Please contact Shin Yih Cheah for further information via *************.