Carsem (M) Sdn. Bhd. Hiring! Full Time FOL - Staff Engineer - Development in Perak - Ricebowl

JOB OBJECTIVES:

To lead and execute development activities for Front-of-Line (FOL) semiconductor packaging processes, with a focus on continuous improvement, cost efficiency, yield enhancement, and new technology introductions. This role involves cross-functional collaboration to drive process development from concept to qualification and release for mass production.

JOB DUTIES AND RESPONSIBILITIES

1. Power Package and Module Development

• Lead the end-to-end design and development of high-power discrete and power module packaging technologies.
• Define product requirements and translate customer needs into Package Requirement Specifications (PRS) and Supplier Component Documents (SCD).
• Collaborate with designers and process engineers to define internal/external structure, material selection, and optimized assembly flows.
• Ensure robust manufacturability by applying DFM principles and maintaining alignment with quality and cost targets.
• Generate key documentation: DFMEA, control plans, QFD, process FMEA, LAR plans, technical procurement spec etc.
• Manage characterization and qualification phases to ensure design meets electrical, thermal, and reliability goals.
• WBG packaging technology roadmap development/update.

2. NPI Project Management

• Own project schedules, deliverables, and risk mitigation across all NPI phases.
• Manage package prototyping/proof of concept, qualification, and transition to high volume manufacturing.
• Lead technical reviews and gate milestones to ensure on-time development and HVM readiness.
• Coordinate with cross-functional stakeholders (BU, quality, application, manufacturing) for technical alignment and execution.
• Drive problem-solving processes (e.g., 8D, RCCA) to overcome design and process challenges.
• Systematic approach in compliances with the NPI stipulated events/actions deliverable.

3. Leadership and Technical Influence

• Mentor junior engineers and contribute to building a strong internal technical roadmap.
• Support continuous improvement and best practice sharing across development teams.
• Participate in customer technical discussions and support qualification/audit efforts where needed.

TECHNICAL SKILLS & COMPETENCIES

• Minimum 5 years of experience in power module or high-power discrete package development, including hands-on NPI leadership.
• Strong understanding of multiple disciplines in FOL processes including SiC wafer dicing, heated DA process application, Cu/Ag wire & ribbon bonding, Solder reflow, gel-filled modules, and thermal/electrical design considerations etc.
• Ability to develop technology roadmap align with WBG packaging evolvement

TOP 5 GENERIC SKILLS & COMPETENCIES

• Experience with device-package interaction, material selection, and reliability standards (e.g., JEDEC, AEC-Q100).
• Skilled in the use of tools such as AutoCAD, JMP, Minitab, and proficiency in MS Office and technical presentations.
• Strong communication and cross-functional collaboration skills.
• Self-driven, open-minded, problem solver with a proactive mindset.

Risk based thinking in carrying out development roles.