Co-work with external solution provider on end-to-end deployment of AI solutions (computer vision inspection, workflow automation, analytics) for Visual Inspection Process of wafer level chip scale package at Backend process
Translate users’ requirements (eg. auto defect classification, recipe re-teach etc…) into system configurations and AI workflows
Ensure deployed solutions are robust, scalable, and aligned with real production constraints including uptime, safety, and compliance requirements.
Contribute to standardized deployment frameworks and best-practice documentation that accelerate future engagements.
Requirements:
Bachelor's Degree in Computer Science, Computer Science, Electrical Engineering, Mechatronics, or a related technical discipline.
Proficient in programming languages such as Python, Arduino C++, or similar; comfort with scripting, configuration, and debugging in production settings.
Familiarity with equipment communication protocols (e.g., SECS/GEM, OPC-UA) or manufacturing execution systems (MES).
Experience with system integration, data pipelines, edge computing, or cloud deployment in operational technology(OT) environments.
Exposure to AI/ML concepts, deep learning frameworks, or computer vision tooling (e.g., OpenCV, PyTorch, TensorFlow)