FusionAP Hiring! Full Time Principal Engineer in Pulau Pinang - Ricebowl

Company Description FusionAP is a semiconductor company founded by seasoned engineering professionals specializing in advanced packaging technologies. The organization is focused on delivering world-class advanced packaging solutions to global customers while building Malaysia’s first high-value, next-generation packaging hub. FusionAP drives innovation through engineering excellence and strategic partnerships, creating opportunities to work on cutting-edge technology. The company actively supports national priorities in AI, automotive, and high-performance computing, offering engineers a chance to contribute to impactful, future-ready industries. Team members join a growing, technology-driven environment with strong emphasis on quality, collaboration, and continuous improvement.

Role Description This is a full-time, on-site Principal Engineer role based in Penang, Malaysia. The rapid expansion of high-performance computing, artificial intelligence, and automotive electronics requires advanced Flip Chip Ball Grid Array (FCBGA) packaging with uncompromising reliability 1. We are seeking an innovative and highly capable Principal Process Development Engineer specializing in Mold and Capillary Underfill (CUF) processes.

In this critical Technology Development (TD) role, you will be the technical owner of liquid epoxy underfill dispensing, which is essential for encapsulating fine-pitch interconnects and protecting them from thermal fatigue. By applying fluid dynamics, polymer physics, and rigorous experimentation, you will develop precision CUF processes that support the mass production of next-generation, high-reliability semiconductor packages.

Key Responsibilities

      Process Development & Dispensing Optimization: Develop, characterize, and establish baseline manufacturing recipes for CUF dispensing in high-density, fine-pitch FCBGA and multi-die chiplet architectures. You will program and calibrate precision dispensing equipment, including high-speed jetting valves and volumetric process.

      Fluid Dynamics & Polymer Physics: Apply analytical models to understand and control the capillary flow of silica-filled epoxies between parallel plates. You will conduct fluid dynamics modelling to control flow rates, eliminate voiding, and optimize fillet cosmetics.

      Experimental Rigor: Design and execute multi-factor Design of Experiments (DOE) to establish robust process windows and performance baselines. Effectively utilize Scanning Acoustic Microscopy (C-SAM) to inspect for underfill voids and delamination and conduct root cause failure analysis (RCFA) using cross-sectioning and SEM to drive corrective action plans

      Yield Improvement & Quality Control: Lead continuous yield improvement, defect reduction, and cost optimization initiatives. Implement Statistical Process Control (SPC) and apply methodologies like FMEA, Control Plans for effective early signal detection.  You will optimize the process for various bump standoff heights to prevent underfill voids, particularly in large die applications, and ensure the process meets stringent reliability standards by completely avoiding filler entrapment issues associated.

      Technology Transfer & Quality Control: Own the transition of CUF processes from R&D pathfinding to high-volume manufacturing (HVM). You will author Process Failure Mode and Effects Analyses (pFMEAs), standard operating procedures (SOPs), and Control Plans while ensuring all materials comply with RoHS workmanship standards.

Qualifications

• Strong expertise in semiconductor engineering and advanced packaging, with a track record of leading complex technical projects.
• Proficiency in system and hardware architecture, design optimization, and integration for high-performance and reliable solutions.
• Experience with process development, validation, and manufacturing collaboration to ensure scalability and quality.
• Demonstrated skills in technical leadership, team mentorship, cross-functional collaboration, and stakeholder communication.
• Ability to apply rigorous problem-solving, data-driven decision-making, and root-cause analysis to engineering challenges.
• Background working on applications in AI, automotive, or high-performance computing is highly beneficial.
• Bachelor’s or Master’s degree in Electrical Engineering, Electronics, Materials Science, or a related field; advanced degree or equivalent experience preferred.
• Comfort working on-site in a fast-paced engineering environment and aligning technical initiatives with business objectives.