Sandisk Hiring! Full Time Process Engineer - Underfill Process (UF) in WP Kuala Lumpur - Ricebowl

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Responsible for the Underfill (UF) process for flip-chip die-level assembly.

• Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.

• Maintain assembly yield and assembly test yield related to the Underfill process in line with department targets and KPIs, including lot bracketing and disposition.

• Set up new Underfill processes, materials, and recipes, including process window studies, DOE execution, and corner limit evaluations.

• Establish golden recipes for new package qualifications.

• Maintain Underfill recipe templates according to Positrol log guidelines.

• Lead process qualifications to achieve CTQ requirements, CPK targets, risk assessment requirements, UPH, yield, and cost objectives.

• Lead new product qualifications and ensure effective process handover and technology transfer.

• Support the qualification of new materials, equipment, and tools.

• Perform root cause analysis and problem-solving using methodologies such as 5M+1E, 5 Whys, DMAIC, and 8D.

• Monitor and optimize Underfill equipment performance, including preventive maintenance coordination and troubleshooting of process deviations.

• Develop and maintain comprehensive process documentation, including work instructions, process specifications, and technical reports for regulatory compliance and knowledge retention.

• Collaborate with cross-functional teams including Quality, Manufacturing, and Product Engineering to resolve process issues and implement continuous improvements.

• Provide technical training and mentoring to assembly technicians and junior engineers on Underfill process best practices and equipment operation.

• Carry out additional tasks and responsibilities assigned by the direct and indirect managers.

REQUIRED:

• Bachelor's Degree or higher in Engineering (Electrical, Mechanical, Physics, Materials Science, or a related field).
• Minimum 4–5 years of experience in semiconductor assembly process engineering.
• Experience in Underfill process development and sustaining.
• Strong knowledge of semiconductor assembly processes and flip-chip die-level assembly technology.
• Hands-on approach with a strong focus on production support, yield improvement, and quality excellence.
• Working knowledge of Failure Mode and Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, Six Sigma methodologies, Design of Experiments (DOE), and statistical analysis tools such as Minitab and JMP

PREFERRED:

• Familiarity with Nordson dispenser, Heller reflow oven, and C-Scan equipment is an added advantage.
• Knowledge of underfill defect mechanisms such as voiding, fillet irregularities, incomplete fill, delamination, overflow, and package warpage.
• Experience supporting New Product Introduction (NPI), high volume manufacturing (HVM), process transfer, and manufacturing ramp-up activities.
• Familiarity with reliability qualification requirements, including MSL, TCT, HTS, HAST, and board-level reliability testing.
• Demonstrated success in improving underfill yield, cycle time, and process capability while supporting high-volume production and new product ramps.
• Familiarity with SEM, SAM (C-Scan), X-ray, and cross-section analysis for failure investigation and process validation

SKILLS:

• Strong project planning, execution, and problem-solving skills.
• High sense of quality, urgency, ownership, and accountability.
• Excellent communication, interpersonal, and teamwork skills.
• Proven experience in developing and maintaining process documentation, including work instructions, process specifications, control plans, OCAPs, and technical reports.
• Proficiency in structured problem-solving methodologies such as 5M+1E, 5 Whys, DMAIC, and 8D.
• Experience in equipment troubleshooting, preventive maintenance coordination, and process deviation management.
• Strong analytical skills with the ability to interpret process data and drive data-driven decisions.
• Proven ability to lead cross-functional collaboration with Manufacturing, Quality, Packaging Engineering, Equipment Engineering, and suppliers.
• Capability to provide technical coaching, training, and mentoring to operators, technicians, and junior engineers on process best practices and equipment operation.
• Self-motivated, proactive, and capable of working independently in a fast-paced manufacturing environment.
• Strong continuous improvement mindset with a focus on yield enhancement, cost reduction, cycle time improvement, and operational excellence.