Asgard Resources Hiring! Full Time AI Server Thermal Module Engineer in Federal Territory, Earn up to MYR 10,000 - Ricebowl

About Us

Asgard is a Multiple award-winning local recruitment company specialising in connecting top talent with leading companies across the Tech, Banking, Financial Services, Insurance (BFSI), Oil & Gas, and Fast-Moving Consumer Goods (FMCG) sectors.

About the Role

Our client, a Fortune 500 global electronics manufacturing solutions provider serving AI server, cloud infrastructure, and consumer electronics brands, is hiring a Thermal Module Engineer to own thermal module design and optimisation for next-generation AI server and liquid cooling solutions.

Responsibilities

• Lead thermal module design and development, including cold plate architecture and liquid cooling integration
• Conduct thermal performance testing, validation, and reliability evaluation
• Drive process development for thermal module manufacturing and mass production readiness
• Perform PFMEA, root cause analysis, and corrective actions for reliability issues
• Collaborate cross-functionally to support new product introduction (NPI)
• Support thermal simulation feedback and product performance improvements
• Provide technical analysis on field issues to support R&D enhancements
• Support global AI server projects from concept through production ramp-up

Requirements

• Bachelor's degree or above in Mechanical, Thermal, Materials, or Electronics Engineering (Master's/PhD preferred especially for candidates with specialization in Thermal Engineering, Heat Transfer, Fluid Dynamics, Mechanical Design, or related fields.)
• Senior: 5+ years relevant experience; Principal/Technical Expert: 8–15+ years in thermal module or cooling system development
• Experience with liquid cooling technologies, thermal simulation tools (ANSYS Icepak, FloTHERM, CFD), and PFMEA/failure analysis

Pay: From RM10,000.00 per month

Benefits:

• Additional leave
• Dental insurance
• Health insurance
• Meal allowance
• Opportunities for promotion
• Professional development
• Vision insurance

Ability to commute/relocate:

• Kuala Lumpur: Reliably commute or willing to relocate with an employer-provided relocation package (Preferred)

Application Question(s):

• Do you hold a Bachelor's/Master's/PhD in Mechanical, Thermal, Materials, or Electronics Engineering (or a related field)? (Yes/No)
• Do you have at least 5 years of experience in thermal module or liquid cooling system development? (Yes/No)
• Do you have hands-on experience with thermal simulation tools such as ANSYS Icepak or FloTHERM? (Yes/No)
• Do you have experience supporting a product from R&D through mass production transfer? (Yes/No)
• Do you have experience in AI server or data center server thermal solutions specifically? (Yes/No)

Language:

• English (Preferred)
• Mandarin (Preferred)

Willingness to travel:

• 75% (Preferred)

Work Location: In person