- Sembawang North Region (Singapore) Singapore
Broadcom Hiring! Full Time III-V Wafer Fab Process Engineer (Lithography) in North Region (Singapore) - Ricebowl
III-V Wafer Fab Process Engineer (Lithography)
Broadcom
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Job Description
Responsibilities
Job Description:
Position Summary
The III-V Wafer Fab Process Engineer is responsible for developing, qualifying, and sustaining photolithography and etch processes used in the manufacture of III-V compound semiconductor devices, including InP and GaAs based technologies. The engineer will establish robust manufacturing processes for R&D, new product, optimize yield and process capability, support high-volume manufacturing, and collaborate with cross-functional teams to deliver reliable and cost-effective manufacturing solutions.
Key Responsibilities
Develop and optimize photolithography processes for III-V wafer fabrication.
Position Summary
The III-V Wafer Fab Process Engineer is responsible for developing, qualifying, and sustaining photolithography and etch processes used in the manufacture of III-V compound semiconductor devices, including InP and GaAs based technologies. The engineer will establish robust manufacturing processes for R&D, new product, optimize yield and process capability, support high-volume manufacturing, and collaborate with cross-functional teams to deliver reliable and cost-effective manufacturing solutions.
Key Responsibilities
Develop and optimize photolithography processes for III-V wafer fabrication.
- Establish process windows for critical lithography parameters, including:
- Photoresist coating, bake and develop
- Exposure dose and focus
- Overlay accuracy
- Critical dimension (CD) control
- Pattern fidelity and defectivity
- Qualify new photoresists, developers, bottom anti-reflective coatings (BARC), and lithography materials.
- Develop processes for broadband, i-line, DUV (193 nm), aligner/stepper/scanner platforms.
- Optimize lift-off lithography processes for metal patterning.
- Minimize defects such as particles, bridging, resist lifting, and pattern collapse.
- Mask Layout and reticle design / tape out
- Develop qualification plans for new lithography and etch equipment.
- Define process acceptance criteria and process capability targets.
- Conduct Design of Experiments (DOE) to optimize process windows.
- Perform process characterization and statistical analysis.
- Monitor process health using SPC.
- Investigate process excursions and implement corrective and preventive actions.
- Troubleshoot lithography and etch-related issues affecting yield or productivity.
- Support engineering lots, pilot production, and high-volume manufacturing.
- Analyze yield loss associated with lithography and etch processes.
- Perform root cause analysis using 8D, 5 Why, Fishbone, and FMEA methodologies.
- Drive continuous improvement projects to reduce defects and improve process capability.
- Develop and maintain: WI, Control Plans, PFMEA, OCAP, Process Recipes, ECO
- Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or Microelectronics.
- 10+ years of semiconductor wafer fabrication experience.
- Minimum 10 years of direct experience in lithography and/or plasma etch processes.
- Experience with III-V semiconductor manufacturing is highly preferred.
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