全职 Application Engineer 工作, 薪水 up to MYR 2, SPT Asia Pte Ltd Melaka 公司招聘中 - Ricebowl

Essential Duties and Responsibilities include the following (other duties may be assigned):

Customer Technical Support

• Provide on-site and remote application support for semiconductor assembly processes.
• Assist customers in optimizing wire bonding (ball or wedge bond) and die bonding processes to achieve target yield and reliability.
• Analyze bonding issues and recommend suitable tooling and process improvements.
• Support customer qualifications, DVT, pilot runs, and production ramp-up activities.

Product & Process Development

• Develop application solutions for Capillary, Wedge, and Die Bonding Tool products.
• Evaluate new bonding tool designs for customer applications.
• Conduct bonding trials and performance evaluations.
• Generate technical reports and recommend product improvements.

Customer Engagement

• Work closely with customers' Process Engineering, Manufacturing Engineering, and Quality teams.
• Conduct technical discussions, product demonstrations, and application training.
• Build and maintain long-term technical relationships with key customers.

New Product Introduction (NPI)

• Support qualification of new semiconductor packages and devices.
• Collaborate with R&D during new product development.
• Provide feedback from customer evaluations to accelerate product improvements.
• Ensure smooth transition from development to mass production.

Failure Analysis & Problem Solving

• Investigate bonding failures and tooling performance issues.
• Perform root cause analysis using structured problem-solving methodologies.
• Recommend corrective and preventive actions.
• Coordinate internally with Manufacturing, Quality, and Engineering teams.

Market & Technical Intelligence

• Monitor semiconductor packaging trends and emerging technologies.
• Support product benchmarking against competitors.
• Identify new application opportunities in AI, Automotive, Power, Memory, RF, and Advanced Packaging.

Documentation

• Prepare application reports and technical presentations.
• Develop process guidelines and best practices.
• Maintain customer evaluation records and technical databases.

Education and/or Experience

• Bachelor's Degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronics Engineering, Physics, or a related discipline.
• 3–5 years of experience in semiconductor assembly or packaging.
• Experience in one or more of the following: Ball Bonding, Wedge Bonding, Die Bonding, Flip Chip, Semiconductor Packaging
• Knowledge of semiconductor manufacturing processes is preferred.

Knowledge & Skills

• Strong knowledge of semiconductor wire bonding, die bonding, and packaging processes.
• Experience in application development, process optimization, and troubleshooting for semiconductor assembly.
• Good understanding of Capillary, Wedge Bonding Tool, and Die Bonding Tool technologies.
• Familiarity with structured problem-solving and root cause analysis methodologies.
• Strong analytical, technical report writing, and presentation skills.
• Good project management and organizational skills.
• Proficient in Microsoft Office applications.
• Willingness to travel domestically and internationally as required.

Pay: RM1.00 - RM2.00 per month

Work Location: Remote