SPARKGRID PTE. LTD. Hiring! Full Time Senior Packaging Engineer (Advanced Semiconductor Packaging) in West Region (Singapore), Earn up to SGD 6,000 - Ricebowl

Key Responsibilities

·      Package Architecture & Design: Define and develop semiconductor package solutions (e.g., Flip-Chip, Wirebond, 2.5D/3D, Chiplets, CoWoS, FOWLP, SiP) from concept to mass production.

·      Evaluate package architectures, interconnect strategies, substrate stack-ups, and material selections to meet electrical, thermal, mechanical, and reliability requirements.

·      Design and define substrate stack-ups, routing strategies, and interconnect structures to meet high-speed, high-density, and manufacturability requirements.

·      Collaborate with SI/PI teams to optimize package-level electrical performance including high-speed IO and power delivery.

·      Simulation & Multi-Physics Collaboration: Collaborate with thermal and mechanical engineering teams to perform simulations (warpage, stress, CTE mismatch).

·      New Product Introduction (NPI) &Manufacturing: Lead package development through NPI to high-volume manufacturing (HVM), ensuring DFM, cost, yield, and reliability targets.

·      Collaborate with OSAT vendors and substrate suppliers to ensure process readiness, qualification, and ramp.

·      Process Development & Yield Improvement: Develop backend processes (bumping, assembly, molding, underfill).

·      Materials & Reliability Engineering: Evaluate packaging materials and define BOM.

·      Ensure reliability through qualification and failure analysis.

·      Cross-functional Collaboration: Work with IC design, SI/PI, system, and manufacturing teams for chip-package-system co-design.

Requirements:
·      Master’s degree or above in Mechanical Engineering, Electrical Engineering, Materials Science, Microelectronics, or related fields.

·      3+ years of experience in semiconductor packaging, preferably in advanced packaging.

·      Strong understanding of packaging technologies such as Flip-Chip, FOWLP, WLCSP, and 2.5D/3D integration.

·      Hands-on experience in substrate design (stack-up definition, routing, and manufacturability).

·      Experience with NPI, OSAT engagement, and high-volume manufacturing.

·      Knowledge of package materials, assembly processes, and reliability standards.