jobs in Chipbond Technology Malaysia

Chipbond Technology Malaysia Hiring! Full Time Process Engineer in Pulau Pinang - Ricebowl

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Working Location

  • Pulau Pinang Malaysia

Job Description

Responsibilities

Job Description

  • Monitor process stability, troubleshoot issues, improve yield, and support cross-functional projects and equipment calibration.
  • Support engineering sample testing and assist in multi-platform test operations.
  • Handle online production lot issues, perform troubleshooting, and submit discrepancy reports for low-yield WIP
  • Develop in-depth knowledge of testing processes and equipment. Perform failure analysis and support production and engineering projects.
  • Oversee daily process issues, manage new product introduction, execute improvement projects, and enhance production KPIs.

Job Requirements

  • Bachelor's degree in engineering field, with at least 1 years of experience in process engineering role in semiconductor industry
  • Experienced in area of (Photolithography/ Sputtering / Wafer Probing/ Wafer Sawing/ Wafer Grinding/ Pick and Place / Tape and Reel process) .
  • Mandarin proficiency is highly preferred, as the position involves frequent coordination and reporting to the Taiwan headquarters and Mandarin-speaking clients.
  • Fresh Graduate is encouraged to apply as well.


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