Dell Technologies Hiring! Full Time Packaging Engineer in 台北市, 台灣 - Ricebowl

SUMMARY

Responsible for the packaging engineering to design, develop, and validate packaging solutions that protect servers, notebooks, and desktop products throughout global distribution while optimizing cost and sustainability. This role collaborates closely with product engineering, manufacturing, suppliers, marketing, design, and logistics teams to create packaging that meets performance standards for shock, vibration, and environmental conditions, while also enhancing the customer unboxing experience. The engineer ensures compliance with industry testing standards, drives material and freight efficiency, supports sustainability goals, and manages packaging specifications from concept through production.

ACCOUNTABILITIES

• Design and engineer packaging systems for servers, laptops, and desktops, including cushioning, corrugated structures, and retail packaging.
• Develop solutions that meet protection requirements for shock, vibration, compression, and environmental exposure during distribution.
• Define test plans and validate designs using Dell and industry standards (ISTA, ASTM).
• Partner with hardware engineering teams early in product development to influence product architecture for optimal packability.
• Drive cost-effective packaging strategies including material selection, cube optimization, and freight efficiency.
• Create detailed packaging specifications, drawings, and BOMs.
• Utilize and create AI applications and AI agents as Dell Packaging evolves to a native AI environment.

REQUIRED QUALIFICATIONS

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, or related field.
• 8+ years of experience in packaging engineering
• Strong knowledge of packaging materials: corrugated fiberboard, EPS/EPE foams, molded pulp
• Familiarity with CAD tools (e.g., SolidWorks, ArtiosCAD) for packaging design
• Understanding of global logistics and distribution environments
• Strong analytical, problem-solving, and project management skills

PREFERRED QUALIFICATIONS

• Experience packaging rack-mounted servers or high-value electronics
• Experience working with ODM partners and global supply chains
• Familiarity with automation-friendly packaging designs for manufacturing

SOFT SKILLS

• Excellent communication and cross-functional collaboration skills
• Ability to manage multiple projects in fast-paced environments
• Strong attention to detail with a customer-focused mindset