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Michael Page Hiring! Full Time Die Attach Section Manager in Pulau Pinang - Ricebowl

Die Attach Section Manager

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Working Location

  • Pulau Pinang Malaysia

Job Description

Responsibilities

  • Strong Learning and Career Development Opportunities
  • Attractive Compensation and Benefits

About Our Client

Our client is a well-established semiconductor assembly and test organisation with a strong presence in advanced packaging and high-volume manufacturing. They operate in a fast-paced, technology-driven environment, focusing on operational excellence, equipment innovation, and continuous improvement.

Job Description

  • Equipment Management: Oversee operation, troubleshooting, and maintenance of die attach machines (e.g., BESi, Shibuara) and supporting systems like flux cleaning equipment
  • Process Optimisation: Improve yield, reduce defects, and enhance cycle time through process tuning and continuous improvement initiatives
  • Team Leadership: Supervise, coach, and develop technicians and junior engineers across shifts
  • Preventive Maintenance (PM): Establish and execute PM schedules to maximise equipment uptime and reliability
  • Quality Assurance: Monitor key process parameters and implement SPC controls to ensure stable production quality
  • Shift Operations: Support 24/7 production through rotating shifts and operational escalation handling

The Successful Applicant

  • Bachelor's degree in Mechanical/Electrical Engineering or related field
  • 5-7 years of hands-on die attach experience (BESi, Shibuara, or equivalent platforms)
  • Strong troubleshooting capability across mechanical, electrical, and software domains
  • Proven experience in semiconductor assembly or packaging environments
  • Demonstrated leadership or supervisory experience (preferred for managerial level)
  • Familiar with ISO standards, safety protocols, and equipment qualification processes
  • Key traits: resilient, detail-oriented, strong work ethic, and effective communicator

What's On Offer

  • Opportunity to step into (or further develop) a managerial leadership role
  • Exposure to advanced semiconductor packaging technologies
  • A high-performance environment with direct impact on production outcomes
  • Career progression within an established semiconductor organisation
  • Hands-on involvement in equipment installation, qualification, and optimisation projects

Contact

Quote job ref: JN-*************

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