jobs in UST Malaysia

UST Malaysia Hiring! Full Time IC Package Design Engineer in Pulau Pinang - Ricebowl

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Working Location

  • Bayan Lepas Pulau Pinang Malaysia

Job Description

Responsibilities

Job Description:


  • Executing high density package layout designs across client’s product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles and more)
  • IC package layout design including feasibility studies, substrate layout design/routing, package stack up, ballmap etc.
  • Perform DRC checks, unconnected pins and dangling trace/vias and fix the design accordingly.
  • Perform design self-check based on the design review checklist provided and fix the design accordingly.
  • Perform design cleanup with PLA tools. (Depend on the accessibility of the PLA tools)
  • Full package design including all/partial interfaces assignment as well as power assignment according to schematic that provided. Might include the component placement and constraint setting as well as other package design related request.
  • Using the Mentor Graphics Xpedition PCB software to design the substrate in compliance with existing design rules, electrical requirements and processes.
  • Must understand various interface requirement like DDR/PCIe/SERDES etc.
  • Good technical knowledge of electrical field theories, electronic fundamentals, sound knowledge in electromagnetic and microwave theory


Job Requirements:


  • Expertise in high speed PCB Design using Mentor Graphics (Xpedition VX), working knowledge in GPIO, HSSIO.
  • Expertise in Net, Pin pair and combination-net (Xnets) length matching
  • Expertise in CAM setup and Gerber generation
  • Accustomed to designing PCB's with a high awareness of “Design for Manufacturing, Assembly, and Test” requirements
  • Expertise in Edge-Coupled and Broadside-Coupled Differential pairs and Designed impedance
  • Expertise in using Through–Hole, Blind, Buried, Micro & Power vias in PCB.
  • Good command on critical signal routing, cross talks, EMI, EMC, Clock signal, Mixed Signal Routings and Power plane distribution.
  • Experience in preparation of Fabrication and Assembly Drawings
  • Advanced knowledge of constraints and use of the constraint manager
  • Experience in documentation like PCB Guidelines, Processes, Checklists and Training materials.
  • Bachelor's or Master's degree in Electrical/Electronics Engineering or related field with 2+ years in the related fields.


Note: Open to local candidates only.

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