Perform detailed electrical and physical failure analysis to isolate faults in memory devices.
Hand-on advanced FA tools (SEM, FIB, nanoprobing, OBIRCH) for defect localization and characterization.
Able to interpret circuit schematics and layouts for defect localization and collaborate with product or design engineers on complex cases.
Collaborate with cross‑functional teams including design, process integration, reliability, and product engineering teams to improve product reliability, yield, test coverage and RMA.
Develop and present failure models based on findings.
Provide clear FA reports, evidence, and recommendations to support corrective actions.
Own FA tools, maintain procedures, and improve analysis methodologies.
Mentor junior engineers in FA techniques and best practices
Help expand lab capabilities by exploring new tools and methods to enhance failure analysis.
Required:
PhD or MS degree in Electrical Engineering, Materials Science & Engineering, Physics, or related fields
Minimum 6 years in related experience
Strong foundation in semiconductor device physics and electronic circuits
Enthusiasm for hands-on lab work and problem-solving
Extensive knowledge in several advanced technical areas of the FA field.
Ability to execute complex, specialized technical projects or assignments.
Preferred :
Excellent writing, editing, communication and presentation skills
Skills
Excellent writing, editing, communication and presentation skills