- Melaka Malaysia
Texas Instruments Hiring! Full Time Packaging Engineer in Melaka - Ricebowl
Working Location
Job Description
Responsibilities
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Packaging Engineer
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Melaka, Malaysia
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Apply Now
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Job Description
Change the world. Love your job.
As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
Develop new package requirements and maintaining quality of existing packages for all product groups
Define package requirements for product groups and customer requirements
Develop new package and process qualification programs.
Perform integrity analysis of packages utilizing appropriate tools
Perform package characterizations including cost effectiveness studies.
Act as a liaison with vendors
Maintain product quality while developing and introducing package cost reduction programs
Coordinate the introduction of new package processes into production
Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies
.component-styling-wrapper-105040 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105040 .job-details__description-content { color: rgbfont-family: 'Roboto', Arial, sans-serif; } @media all and (min-width: 768px) { .component-styling-wrapper-105040 .job-details__description-content { font-size: 16px; line-height: 1.5 } }
Qualifications
Minimum requirements:
Bachelor's degree in Chemical, Material Science, Mechanical, Electrical or other related Engineering degree. Master’s degree a plus.
Minimum 5 years of relevant experience
Hands-on process engineering experience in AT LEAST ONE of the following technical areas:
Option 1: Wafer-to-carrier Temporary Bonding and Debonding (TB/DB) systems, thermal/mechanical bonding processes, and total thickness variation (TTV) control
Option 2: Photolithography track processes (polymer spin coating, curing, bake ovens) OR automated wet bench processing (photoresist stripper, polymer cleaning, and glass/silicon wafer cleaning)
Experience or involvement in equipment installation, cleanroom hook-up coordination and tool startup/readiness
Preferred qualifications:
Experience in bump and wafer level processing
Initiative-driven mindset with desire to own projects and drive results
Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
Strong verbal and written communication skills
Ability to quickly ramp on new systems and processes
Demonstrated strong interpersonal, analytical and problem-solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
.component-styling-wrapper-105033 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105033 .job-details__description-content { color: rgbfont-family: 'Roboto', Arial, sans-serif; } @media all and (min-width: 768px) { .component-styling-wrapper-105033 .job-details__description-content { font-size: 16px; line-height: 1.5 } }
About Us
Why TI?
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at *************
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
.component-styling-wrapper-105030 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105030 .job-details__description-content { color: rgbfont-family: 'Roboto', Arial, sans-serif; } @media all and (min-width: 768px) { .component-styling-wrapper-105030 .job-details__description-content { font-size: 16px; line-height: 1.5 } }
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
.component-styling-wrapper-105028 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105028 .job-meta__title { color: rgbfont-family: 'Roboto-500', Arial, sans-serif; font-size: 16px; } .component-styling-wrapper-105028 .job-meta__subitem { color: rgbfont-family: 'Roboto', Arial, sans-serif; font-size: 16px; }
Job Info
Job Identification 25011200
Job Category Engineering - Product Dev
Posting Date 06/24/2026, 02:56 PM
Apply Before 07/03/2026, 09:00 AM
Degree Level Bachelor's Degree
Locations MELA Batu Berendam Free Trade Zone, Melaka, 75350, MY
Shift/Work Schedule N
ECL/GTC Required Yes
Packaging Engineer
.component-styling-wrapper-105038 .job-details__subtitle { color: rgbfont-family: 'Roboto', Arial, sans-serif; font-size: 16px; text-align: center; line-height: 1.5 }
Melaka, Malaysia
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Apply Now
.component-styling-wrapper-105039 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105039 .job-details__description-content { color: rgbfont-family: 'Roboto', Arial, sans-serif; } @media all and (min-width: 768px) { .component-styling-wrapper-105039 .job-details__description-content { font-size: 16px; line-height: 1.5 } }
Job Description
Change the world. Love your job.
As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
Develop new package requirements and maintaining quality of existing packages for all product groups
Define package requirements for product groups and customer requirements
Develop new package and process qualification programs.
Perform integrity analysis of packages utilizing appropriate tools
Perform package characterizations including cost effectiveness studies.
Act as a liaison with vendors
Maintain product quality while developing and introducing package cost reduction programs
Coordinate the introduction of new package processes into production
Prepare and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies
.component-styling-wrapper-105040 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105040 .job-details__description-content { color: rgbfont-family: 'Roboto', Arial, sans-serif; } @media all and (min-width: 768px) { .component-styling-wrapper-105040 .job-details__description-content { font-size: 16px; line-height: 1.5 } }
Qualifications
Minimum requirements:
Bachelor's degree in Chemical, Material Science, Mechanical, Electrical or other related Engineering degree. Master’s degree a plus.
Minimum 5 years of relevant experience
Hands-on process engineering experience in AT LEAST ONE of the following technical areas:
Option 1: Wafer-to-carrier Temporary Bonding and Debonding (TB/DB) systems, thermal/mechanical bonding processes, and total thickness variation (TTV) control
Option 2: Photolithography track processes (polymer spin coating, curing, bake ovens) OR automated wet bench processing (photoresist stripper, polymer cleaning, and glass/silicon wafer cleaning)
Experience or involvement in equipment installation, cleanroom hook-up coordination and tool startup/readiness
Preferred qualifications:
Experience in bump and wafer level processing
Initiative-driven mindset with desire to own projects and drive results
Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
Strong verbal and written communication skills
Ability to quickly ramp on new systems and processes
Demonstrated strong interpersonal, analytical and problem-solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
.component-styling-wrapper-105033 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105033 .job-details__description-content { color: rgbfont-family: 'Roboto', Arial, sans-serif; } @media all and (min-width: 768px) { .component-styling-wrapper-105033 .job-details__description-content { font-size: 16px; line-height: 1.5 } }
About Us
Why TI?
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at *************
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
.component-styling-wrapper-105030 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105030 .job-details__description-content { color: rgbfont-family: 'Roboto', Arial, sans-serif; } @media all and (min-width: 768px) { .component-styling-wrapper-105030 .job-details__description-content { font-size: 16px; line-height: 1.5 } }
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
.component-styling-wrapper-105028 .job-details__description-header { color: rgbtext-align: center; } .component-styling-wrapper-105028 .job-meta__title { color: rgbfont-family: 'Roboto-500', Arial, sans-serif; font-size: 16px; } .component-styling-wrapper-105028 .job-meta__subitem { color: rgbfont-family: 'Roboto', Arial, sans-serif; font-size: 16px; }
Job Info
Job Identification 25011200
Job Category Engineering - Product Dev
Posting Date 06/24/2026, 02:56 PM
Apply Before 07/03/2026, 09:00 AM
Degree Level Bachelor's Degree
Locations MELA Batu Berendam Free Trade Zone, Melaka, 75350, MY
Shift/Work Schedule N
ECL/GTC Required Yes
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