- 松山區 105, 台灣 台灣
Corning Hiring! Full Time Engineer III in 105, 台灣 - Ricebowl
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Date: Jun 24, 2026
Location: Taipei, TW, 105
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Company: Corning
Role Purpose
The Senior Systems Engineer is responsible for working directly with our customers and ecosystem partners to understand their product challenges, create system-level solutions, translate those solutions into product requirements, and drive design-in of Corning's Co-Packaged Optics (CPO) products. The role combines deep technical expertise in semiconductor manufacturing and photonic connectivity with a strong customer-facing orientation, serving as the technical interface between Corning R&D, program management and the business team to shape the future of AI infrastructure in hyperscale data centers.
This is a highly visible role that combines deep systems expertise with strong communication skills to guide our customers from early architecture discussions through design-in and qualification to serial production, bridging internal engineering teams and our customers to solve deployment challenges and influencing the CPO roadmap based on direct customer insight.
Key Responsibilities
Serve as a primary technical point of contact for strategic customers and ecosystem partners throughout the CPO product lifecycle - from early architecture discussions through design-in, qualification, and deployment
Lead product and system ideation with our customers and partners, with the goal of addressing identified needs through differentiated product offerings
Translate customer requirements into internal product specifications, ensuring alignment between external needs and Corning's R&D and product development capabilities.
Conduct feasibility studies and develop initial design concepts to be transferred to R&D
Establish ongoing and trusting relationships with technical counterparts amongst our primary customers and partners within the CPO ecosystem.
Develop a deep understanding of customer applications, the systems in which they operate, and how Corning products function in these applications.
Lead technical deep-dive sessions, architecture workshops, and design reviews with customer engineering teams, including hyperscaler network architects and ASIC/platform engineers.
Perform system level thermo-mechanical simulations to provide design recommendations
Deliver compelling technical presentations, demos, and proof-of-concept (PoC) engagements
Participate in mapping out market trends and technology roadmaps, identifying key gaps and recommendations in terms of both technology capabilities and new products.
In close collaboration with PLM and Marketing, help refine Corning's value proposition in the context of a deep understanding of the applications and use cases of our CPO solutions
Collaborate with ASIC partners, packaging houses, laser vendors, and connector suppliers as well as hardware providers to build understanding of next generation requirements
Act as the voice of the customer inside Corning, driving requirement clarity, feature prioritization, and responsiveness to field feedback.
Experiences/Education - Required
Master's or Doctorate Degree in Engineering, Applied Science, or equivalent fields.
7+ years of experience in an applications, systems, or product development function, with meaningful time in a customer-facing technical role (Systems Engineer, Applications Engineer, Scientist, or Solutions Architect).
Participation in complex projects and contribution to multi-functional teams in a fast-paced competitive environment.
Deep understanding of one or more of the following: optics, glass as a material, optical fiber and communications, Silicon Photonics, semiconductor packaging, semiconductor metrology, electronic hardware design and manufacturing.
Ease with frequent customer engagements at a technical level, with the ability to comprehend technical needs and convey effective value propositions.
Ability to collaborate across functional and geographical boundaries to solve problems and develop solutions.
Conceptualize complex specification and application requirements and articulate to internal/external stakeholders to initiate new product development or implement product changes.
Mobilize and influence people within and outside the organization to meet objectives.
Garner trust and lead collaborative work efforts, both internally and externally, across multiple time zones.
Experiences/Education - Desired
Work experience in PLM, Manufacturing, Systems Engineering, and/or Product Development in a fast-paced OEM context.
Systems-level knowledge of CPO architectures, including photonic engines, external laser sources (ELS/ELSFP), fiber attach, ASIC integration and advanced packaging.
Direct experience deploying CPO, NPO, LPO, or advanced pluggable optics in production or pre-production environments.
Familiarity with AI/ML fabric architectures (scale-up / scale-out), including GPU/XPU cluster designs and optical I/O requirements.
English + Mandarin (Japanese, or Korean) is a plus for global account coverage.
a.dialogApplyBtn { display: none; }
Date: Jun 24, 2026
Location: Taipei, TW, 105
#job-location.job-location-inline { display: inline; }
Company: Corning
Role Purpose
The Senior Systems Engineer is responsible for working directly with our customers and ecosystem partners to understand their product challenges, create system-level solutions, translate those solutions into product requirements, and drive design-in of Corning's Co-Packaged Optics (CPO) products. The role combines deep technical expertise in semiconductor manufacturing and photonic connectivity with a strong customer-facing orientation, serving as the technical interface between Corning R&D, program management and the business team to shape the future of AI infrastructure in hyperscale data centers.
This is a highly visible role that combines deep systems expertise with strong communication skills to guide our customers from early architecture discussions through design-in and qualification to serial production, bridging internal engineering teams and our customers to solve deployment challenges and influencing the CPO roadmap based on direct customer insight.
Key Responsibilities
Serve as a primary technical point of contact for strategic customers and ecosystem partners throughout the CPO product lifecycle - from early architecture discussions through design-in, qualification, and deployment
Lead product and system ideation with our customers and partners, with the goal of addressing identified needs through differentiated product offerings
Translate customer requirements into internal product specifications, ensuring alignment between external needs and Corning's R&D and product development capabilities.
Conduct feasibility studies and develop initial design concepts to be transferred to R&D
Establish ongoing and trusting relationships with technical counterparts amongst our primary customers and partners within the CPO ecosystem.
Develop a deep understanding of customer applications, the systems in which they operate, and how Corning products function in these applications.
Lead technical deep-dive sessions, architecture workshops, and design reviews with customer engineering teams, including hyperscaler network architects and ASIC/platform engineers.
Perform system level thermo-mechanical simulations to provide design recommendations
Deliver compelling technical presentations, demos, and proof-of-concept (PoC) engagements
Participate in mapping out market trends and technology roadmaps, identifying key gaps and recommendations in terms of both technology capabilities and new products.
In close collaboration with PLM and Marketing, help refine Corning's value proposition in the context of a deep understanding of the applications and use cases of our CPO solutions
Collaborate with ASIC partners, packaging houses, laser vendors, and connector suppliers as well as hardware providers to build understanding of next generation requirements
Act as the voice of the customer inside Corning, driving requirement clarity, feature prioritization, and responsiveness to field feedback.
Experiences/Education - Required
Master's or Doctorate Degree in Engineering, Applied Science, or equivalent fields.
7+ years of experience in an applications, systems, or product development function, with meaningful time in a customer-facing technical role (Systems Engineer, Applications Engineer, Scientist, or Solutions Architect).
Participation in complex projects and contribution to multi-functional teams in a fast-paced competitive environment.
Deep understanding of one or more of the following: optics, glass as a material, optical fiber and communications, Silicon Photonics, semiconductor packaging, semiconductor metrology, electronic hardware design and manufacturing.
Ease with frequent customer engagements at a technical level, with the ability to comprehend technical needs and convey effective value propositions.
Ability to collaborate across functional and geographical boundaries to solve problems and develop solutions.
Conceptualize complex specification and application requirements and articulate to internal/external stakeholders to initiate new product development or implement product changes.
Mobilize and influence people within and outside the organization to meet objectives.
Garner trust and lead collaborative work efforts, both internally and externally, across multiple time zones.
Experiences/Education - Desired
Work experience in PLM, Manufacturing, Systems Engineering, and/or Product Development in a fast-paced OEM context.
Systems-level knowledge of CPO architectures, including photonic engines, external laser sources (ELS/ELSFP), fiber attach, ASIC integration and advanced packaging.
Direct experience deploying CPO, NPO, LPO, or advanced pluggable optics in production or pre-production environments.
Familiarity with AI/ML fabric architectures (scale-up / scale-out), including GPU/XPU cluster designs and optical I/O requirements.
English + Mandarin (Japanese, or Korean) is a plus for global account coverage.
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