PERSOL Hiring! Full Time Principal Process Engineer (ID:697697) in Pulau Pinang - Ricebowl

Responsibilities

• Own and optimize MOL processes (chip/component attach, dispensing, reflow, solder ball jetting, transfer, pick & place).

• Maintain working knowledge of FOL processes (die attach, flip chip, eutectic bonding, wire bonding).

• Establish process parameters, control plans, and work instructions to ensure robust manufacturing.

• Design and execute DOE for process optimization and perform SPC analysis to prevent excursions.

• Perform process characterization, window definition, and robustness studies.

• Lead yield improvement initiatives through root cause analysis (8D, Fishbone, FMEA).

• Support NPI by defining process flows, tooling, materials, and leading process qualifications (IQ/OQ/PQ).

• Collaborate with equipment engineers on specifications, installation, qualification, and troubleshooting.

• Evaluate and qualify new materials (adhesives, substrates, fibers, components) for cost and performance optimization.

• Develop and maintain documentation (process flows, WI, control plans, FMEA) ensuring ISO/quality compliance.

• Train production personnel and CM partners on new processes and updates.

• Provide technical leadership and collaborate with Product, Quality, Manufacturing, and Supply Chain teams to resolve process-related issues.

Requirements

• Bachelor’s or Master’s degree in Electrical, Electronic, Mechanical, Mechatronics, or related engineering fields.

• Minimum 12 years of experience in semiconductor, electronics, or high-tech manufacturing.

• Strong knowledge of semiconductor assembly and photonics packaging, with hands-on MOL process expertise.

• Ability to perform process characterization, window definition, and robustness studies.

• Proficiency in DOE, SPC, FMEA, 8D, and yield/data analysis; familiarity with optical testing and alignment is advantageous.

• Strong analytical and problem-solving skills with effective communication across global and cross-functional teams.

• Independent, proactive, and results-driven mindset in fast-paced environments; exposure to silicon photonics or optical module packaging is a plus.