Fuji Electric (Malaysia) Sdn. Bhd. Hiring! Full Time Equipment Engineer in Kedah - Ricebowl

JOB RESPONSIBILITIES:

• System Availability: Execute preventive (PM) and predictive maintenance to maximize Tool Availability and Mean Time Between Failures (MTBF).
• Rapid Response Troubleshooting: Diagnose complex hardware/software failures on wafer fabrication equipment. Lead Root Cause Analysis (RCA) to eliminate repeat issues and minimize Mean Time to Repair (MTTR).
• Process Synergies: Partner with Process Engineers to optimize equipment parameters, aiming for improved CPK (Process Capability Index) and overall wafer yield.
• Continuous Improvement: Identify and implement hardware upgrades or modifications to enhance tool performance and safety.
• Quality & Compliance: Perform precise calibrations and validations to ensure equipment meets stringent process specifications and safety standards (e.g., EHS, ISO).
• Data-Driven Monitoring: Utilize Statistical Process Control (SPC) and FDC (Fault Detection and Classification) to monitor tool health and pre-emptively address drifting parameters.
• Knowledge Transfer: Maintain technical documentation, including SOPs and OCAPs (Out-of-Control Action Plans). Provide technical mentorship to junior technicians.

JOB REQUIREMENTS:

• Education: Bachelor’s Degree in Electrical, Mechanical, Mechatronic Engineering, or related technical field.
• Experience: Minimum 5 years of Equipment Engineering experience in a Semiconductor / Wafer Fab environment (Cleanroom experience required).
• Shift Flexibility: Must be available to work rotating shifts, including weekends or nights, to support continuous 24/7 manufacturing operations and emergency tool recovery.
• Leadership: Proven ability to mentor technical teams and balance urgent production priorities with long-term tool reliability goals.
• Fresh Graduates: Fresh graduates are encouraged to apply.
• Communication: Strong verbal and written communication skills, with the ability to document processes and procedures clearly and effectively.

Technical & Soft Skills

• Domain Expertise: High proficiency with specific wafer fab platforms (e.g., Lithography, Etch, PVD/CVD, or Metrology).
• Methodology: Strong grasp of SPC, FMEA, 8D Problem Solving, and Lean Manufacturing principles.
• Automation: Familiarity with PLCs, robotics, and SECS/GEM communication protocols is a plus.
• Soft Skills: Resilient under pressure, high attention to detail, and a proactive "owner" mindset regarding equipment health.

Work Environment

• Cleanroom Protocol: Ability to work in a Class 10/100 cleanroom environment, which requires wearing full "bunny suit" PPE for extended periods.