SILICON BOX Hiring! Full Time Equipment Engineering Manager in - Ricebowl

Position Summary

The Equipment Engineering Manager is responsible for leading a team of Equipment Engineers, Associate Engineers and Technicians in ensuring optimal performance, reliability, and continuous improvement of manufacturing equipment across production lines. This role focuses on advanced semiconductor packaging processes, including RDL-related equipment such as Lithography, Patterning, Wet Processing, and Metrology systems.

The incumbent will drive equipment capability, uptime, cost efficiency, and technology transfers from development to high-volume manufacturing while ensuring compliance with quality, safety, and operational standards

Key Responsibilities

• Lead equipment stabilization, reliability improvement, and capability enhancement across manufacturing operations.
• Oversee installation, setup, qualification, and ramp-up of new equipment from development through low-volume to high-volume production.
• Establish and maintain equipment specifications, preventive maintenance plans, SOPs, and documentation to ensure compliance with quality and safety standards.
• Drive equipment performance improvements including uptime, OEE, MTBF/MTTR, and cost of ownership optimization through data-driven analysis.
• Lead troubleshooting, failure analysis, and root cause investigations to resolve equipment-related issues effectively.
• Manage equipment change control processes, spare parts strategy, and lifecycle management.
• Collaborate with process engineering, production, and quality teams to support yield improvement and process capability.
• Work closely with vendors and suppliers on equipment issues, upgrades, and technology improvements.
• Support NPI builds, equipment qualifications, acceptance testing (FAT/SAT), and technology transfers.
• Lead equipment readiness for customer audits and internal compliance reviews.
• Drive continuous improvement initiatives to enhance equipment efficiency, automation, and cost reduction.
• Develop and implement predictive and preventive maintenance strategies, including smart manufacturing and Industry 4.0 initiatives.
• Lead, mentor, and develop the equipment engineering team to ensure strong technical capability and succession planning.
• Manage budgets, capital expenditures (CAPEX), and resource planning for equipment-related projects.
• Other ad-hoc duties and projects as assigned.

Requirements

• Bachelor’s Degree in Electrical Engineering, Mechanical Engineering, Mechatronics, or related Engineering discipline.
• Minimum 10 years of equipment engineering experience in semiconductor manufacturing, with at least 5 years in a leadership role.
• Strong hands-on experience with semiconductor packaging equipment, preferably in wafer-level or fan-out packaging environments.
• Deep understanding of equipment reliability, maintenance strategies, and performance metrics (OEE, MTBF, MTTR).
• Experience in equipment qualification, installation, and ramp-up in high-volume manufacturing.
• Familiarity with process-related equipment used in Lithography, Wet Processing, Etching, and Metrology (e.g., AOI systems).
• Strong analytical and problem-solving skills, with experience in structured methodologies (e.g., RCA, FMEA, 8D).
• Proven ability to lead cross-functional teams and manage multiple projects in a fast-paced manufacturing environment.
• Experience working with equipment vendors and managing technical partnerships.
• Knowledge of automation, digitalization, and Industry 4.0 concepts is an advantage.
• Excellent communication, leadership, and stakeholder management skills.