- Gelang Patah Johor Malaysia

Working Location
Job Description
Responsibilities
Responsibilities
1. Monitor, control, and improve plating and etching production processes to achieve quality, yield, and productivity targets.
2. Troubleshoot process issues and implement corrective and preventive actions.
3. Develop, qualify, and optimise process parameters for new and existing products.
4. Monitor chemical concentrations, process conditions, and equipment performance.
5. Conduct process capability studies, data analysis, and continuous improvement activities.
6. Support new product introduction (NPI), customer qualifications, and engineering trials.
7. Prepare process documentation, work instructions, control plans, and training materials.
8. Work closely with Production, Quality, Maintenance, and R&D teams to resolve manufacturing issues.
9. Ensure compliance with quality systems, safety requirements, and environmental
regulations.
10. Train and guide technicians and operators on process controls and best practices.
Requirements
1. Degree, Diploma, or Technical Qualification in Engineering, Chemistry, Materials Science, or related fields.
2. Minimum 3 years of experience in plating or etching processes within a semiconductor leadframe manufacturing environment.
3. Knowledge of electroplating or chemical etching process control and statistical analysis will be an advantage.
4. Familiar with process troubleshooting, yield improvement, root cause analysis, and quality systems such as ISO 9001, IATF 16949, and customer requirements.
5. Able to work independently and in a team environment, with good communication and problem-solving skills.
Pay: RM5,000.00 - RM6,000.00 per month
Benefits:
Work Location: In person
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