AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED Hiring! Full Time Package Design Engineer in North Region (Singapore), Earn up to SGD 6,500 - Ricebowl

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC).  You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.  These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more.  You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

• Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

• Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, etc.

• Schedule, prioritize, & track your work across multiple projects simultaneously

• General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

• B.Eng (EE/EEE) or similar field  and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes

• M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes

• Knowledge of package-level signal integrity and power integrity, to apply to package designs

• Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers. 

• Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

• B.Eng (EE/EEE)  or similar field  and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.

• M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.