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芯高科技有限公司 Hiring! Full Time Engineer, Hardware - Thermal Management in Hong Kong - Ricebowl

Engineer, Hardware - Thermal Management

芯高科技有限公司

Undisclosed

Hong Kong

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Working Location

  • Hong Kong Hong Kong

Job Description

Responsibilities

Recruit Ref: L*************
Posting Date: 2026-06-08

芯高科技有限公司

Engineer, Hardware & Thermal Management

We are developing a 240W high‑power USB‑C Power Delivery (PD) controller IC and are expanding our prototype team. We are seeking a motivated junior engineer with strong fundamentals in thermos fluids and mechanical design to support thermal optimization and hardware prototyping.

Responsibilities:

  • Assist with thermal analysis and enclosure heat management

  • Perform FEA and CFD simulations

  • Support mechanical design, including housing and heat dissipation structures

  • Participate in prototype assembly, testing, and validation

  • Collaborate closely with power electronics and IC engineers


Job Requirements:

  • Bachelor’s degree in Electronics, Mechanical Engineering, STEM, Science, or a related field

  • Strong background in thermos fluids and heat transfer

  • Experience with ANSYS, SolidWorks, or similar simulation tools

  • Hands-on prototyping and 3D-printing experience

  • Willingness to learn and work in cross-functional teams


This role offers hands-on exposure to real product development and mentorship from experienced engineers.


Industry:
Manufacturing / Industrial
Job Category / Function:
Engineering (Mechanical)
Professional Services (Others)
Job Position Level:
General
Employment Term:
Full Time
Min. Edu. Level Req:
Bachelor
Minimum QF Level attained:
-
Total Working Exp:
-
Salary(HKD):
-
Location:
Tai Po District / Tai Po

Benefits:
-

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