- Hong Kong Hong Kong
Working Location
Job Description
Responsibilities
芯高科技有限公司
Engineer, Hardware & Thermal Management
We are developing a 240W high‑power USB‑C Power Delivery (PD) controller IC and are expanding our prototype team. We are seeking a motivated junior engineer with strong fundamentals in thermos fluids and mechanical design to support thermal optimization and hardware prototyping.
Responsibilities:
Assist with thermal analysis and enclosure heat management
Perform FEA and CFD simulations
Support mechanical design, including housing and heat dissipation structures
Participate in prototype assembly, testing, and validation
Collaborate closely with power electronics and IC engineers
Job Requirements:
Bachelor’s degree in Electronics, Mechanical Engineering, STEM, Science, or a related field
Strong background in thermos fluids and heat transfer
Experience with ANSYS, SolidWorks, or similar simulation tools
Hands-on prototyping and 3D-printing experience
Willingness to learn and work in cross-functional teams
This role offers hands-on exposure to real product development and mentorship from experienced engineers.
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