- Seberang Perai, Penang Perai Pulau Pinang Malaysia
Working Location
Job Description
Responsibilities
Responsibilities:
Equipment / Thermal Head Design and Development – Develop and build prototypes and run tests to measure their level of function.
Provide Costing – Calculate cost estimates for final product designs and release reports to supervisors, incorporating costs of labor, delivery, and overhead.
Responsible for system/product specification and buyoff – Record and evaluate testing data, altering designs as necessary to ensure safety, material, performance, and efficiency standards.
Design data and calculation for DFMEA process – Design products using CAD and consult with engineering and manufacturing teammates to ensure that designs are feasible.
Sequence study – Work with control engineers to optimize the sequence flow through design optimization.
Design for Manufacturing (DFM) through simulation for design margin
Project management and participate in assembly, installation, operation, and troubleshooting of equipment/system.
Documentation – Prepare BOM, Operation Manual, Training Manual, etc.
Requirements
Degree/Diploma in Mechanical Engineering.
Minimum 3 years of relevant experience in equipment precision design and automation, preferably in the semiconductor industry.
Minimum 3 years of experience in Thermal Head, preferably in FT, SLT, and Burn-in testing fields in the semiconductor industry.
Applicants with some design experience will also be considered.
Proficient in 2D/3D CAD software (preferably SolidWorks).
Able to work after office hours when required.
Able to travel overseas at short notice.
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