TF-AMD Penang Hiring! Full Time Section Manager Equipment Engineering (Advanced Packaging- Fan Out) in Pulau Pinang - Ricebowl

Job Purpose & Position Summary

To provide technical and supervisory expertise in maximizing overall equipment effectiveness. Collaborate extensively with regional teams, including HWI, PEO, CIP, etc., to drive equipment and operational improvements. This position requires a strong understanding of hardware and software, excellent communication skills, and the capability to drive and deliver critical business milestones.

Job Responsibilities

• Ensure maintenance procedures and projects are implemented efficiently.
• Support production managers by effectively diagnosing operational issues.
• Resolve identified engineering issues with manufacturing equipment, minimizing downtime.
• Report all issues within the operational area on a planned basis.
• Enforce improvement processes and conduct risk assessments for manufacturing areas.
• Develop competencies and skills of all technical engineering staff to improve plant equipment performance.
• Ensure compliance with all regulatory standards, including health, safety, and environmental requirements.
• Manage all engineering staff and ensure high productivity within the engineering section.
• Confirm spare parts safety stock and prepare the budget monthly.
• Manage the equipment team for their routine jobs.
• Perform other duties as assigned by the Dep. Manager.

Job Qualifications

Must Have:

• Education: Bachelor’s degree or above in Mechanical, Electrical, Electronics, or Mechatronics Engineering.
• Language: Excellent oral and written skills in English.
• Experience: Minimum of 10 years of industrial experience, including at least 5 years in equipment development or maintenance.

-At least 5 years of equipment engineering experience with Plate/Etch/Reflow/Sputter/Clean (Bumping/RDL White Area only).

-At least 5 years of equipment engineering experience with Coater/Exposure/Lamination/Oven (Bumping/RDL Yellow Area only).

• Good knowledge of Electronic, Electrical, or Mechanical Engineering.
• Well-versed and knowledgeable in semiconductor advanced packaging processes.
• Ability to build and maintain effective engineering teams.
• Independent, resourceful, and proactive.
• Effective communication skills.