Infineon Technologies Hiring! Full Time Engineer Unit Process Engineering Die Attach in Melaka - Ricebowl

Quality improvement activities on DDM investigation, disposition and improvement.

Your Role

Key responsibilities in your new role

• Yield improvement activities for Die Attach process.
• Sustain and achieve stability index for package under responsibility.
• Support production on daily issues investigation and improvement in order to achieve Operation performance.
• Sustain and achieve quality stability for DA process to achieve zero spill, FAR.
• Documents update and refine to ensure no expired documents.
• Key driver for yield improvement topic for Die Attach process.
  
  

Your Profile

Qualifications And Skills To Help You Succeed

• Bachelor degree in engineering.
• Knowledge in die attach process and skill.
• Knowledge in process engineering.
• Basic statistical and SPC knowledge.
• Basic problem solving skill.
  
  

#WeAreIn for driving decarbonization and digitalization.

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