全职 Applications Engineer – Advanced Packaging Jobs, in Mason & Co - Ricebowl

We are looking for an experienced Applications Engineer with strong hands-on expertise in die attach processes and advanced packaging equipment.

Key Responsibilities:

• Lead die attach process development and machine programming for die bonding equipment
• Support wire bond and vacuum reflow process development
• Handle sample preparation, testing, inspection, pull/shear testing, and reporting
• Work with advanced packaging materials including solder, epoxy, ceramics, and alloys
• Support customer sample builds and solve complex assembly/process challenges
• Develop process programs and optimize machine performance
• Analyze test results, troubleshoot issues, and recommend solutions
• Support vendor qualification and laboratory maintenance
• Occasionally travel within the region to support customers

Preferred Equipment Exposure:

• Die Bonders
• Wire Bonders
• Vacuum Reflow Systems
• Plasma Systems

Requirements:

• Bachelor’s Degree or Diploma in Engineering/Science related field
• Minimum 5 years experience in Die Attach process/application engineering
• Experience in semiconductor advanced packaging or microelectronics assembly
• Strong understanding of packaging materials and process behavior under temperature/force conditions
• Hands-on machine programming and process optimization experience
• Strong troubleshooting, analytical, and communication skills
• Able to work independently with customers and internal engineering teams