- Singapore Singapore Singapore Singapore 17

Working Location
Job Description
Requirements
Requirement
• Degree in electrical / mechatronics / mechanical/ microelectronics engineering or similar discipline
• Minimum 2 years’ experience working in semiconductor manufacturing environment
• Minimum 2 years of experience working in Molding and De-bonding process.
• Knowledge in basic SPC and Microsoft Office
• Flexible to work under various shift pattern. The selected candidate will start with office hours first, and eventually work on 12-hour rotating shift (day and night)
Responsibilities
Responsibilities
• Ensure process integrity for machine is in place for production
• Process monitoring via SPC / real time monitoring system
• Work on process improvement projects
• Handle disposition and on hold lots
• Maintain good housekeeping in the production area
• Support in recipe setup and qualification for production
• Assist to troubleshoot process-related issue
• Engineering data collection
• Other ad-hoc duties as assigned
Benefits
Skills
Important Information
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