全职 Technical Solution Engineer 工作, 薪水, Heraeus Materials Singapore Pte Ltd 公司招聘中 - Ricebowl

General Summary

1. Provide technical support for Heraeus Assembly Materials products, including solder wire, solder paste solutions for Die Attach, SMT, and SiP applications, as well as sinter paste, serving customers across the APAC region.
2. Deliver technical training and manage customer-related technical challenges and development projects.
3. Lead customer-specific projects and drive the development of tailored technical solutions.
4. Collaborate with Product Marketing and R&D teams to define product specifications, perform product characterization, and support the introduction of new products to the market.
5. Support customer complaint resolution activities, including issue investigation and communication of corrective actions through 8D reports.
6. Provide comprehensive technical and application support throughout the customer lifecycle, from pre-sales consultation to post-sales implementation.
7. Partner with Sales Account Managers to identify and pursue new business opportunities and customer development initiatives.
8. Support customer sample build requests through Application Support Services and HMSL Lab evaluations.

Roles & Responsibilities

1. Responsible for technical support in assembly materials that include solder wire, solder paste product (for SMT & SiP module) and Pressure/Non-pressure sinter paste for APAC customers. (40%)
2. Data collection using all related equipment in the lab, analyze and propose solutions and improvements for enhancing robustness of Heraeus assembly materials. These include collaboration with 3rd party external lab services. (20%)
3. Provide technical consultation and guidance to customers on the application of Heraeus assembly materials for customers’ product application. (10%)
4. Provide on-site customer support with capabilities and understanding of related Heraeus product, process flow, equipment and process windows for problem solving and analysis.(30%)

Qualifications

Bachelor’s Degree in Material/Mechanical Engineering or equivalent practical experience

Required Skills

Strong skill sets in operating all SMT machines, Lab equipment, Technical Problem Solving, Design of Experiments (DOE), FA & CSAM

Good communication and presentation skills.

Experience Requirements

At least 10 years of hands-on experience in semiconductor solder paste and SMT manufacturing processes.

Proven experience in power module assembly or System-in-Package (SiP) packaging is an advantage.

Key Competencies

Skilled in Minitab and JMP for data analysis and process improvement.

Demonstrated leadership and stakeholder management abilities.

Capable of handling complex technical and operational challenges.

Familiar with EMS & OHS

Strong verbal and written communication skills with effective interpersonal engagement.

Fluent in English, both written and spoken.

Strong analytical thinking and structured problem-solving approach.

Proficient in the operation of SMT production equipment and laboratory testing tools.

Solid experience in Failure Analysis and CSAM methodologies.

Abilities

Able to converse fluently and eloquently in English.

*Preference will be given to local candidates or those who do not require visa sponsorship.