全职 Engineer, Process Engineering 工作, 薪水, Sandisk WP Kuala Lumpur 公司招聘中 - Ricebowl

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Maximize wire bond process capability to handle wide range of product portfolio.
• Drive for Wire Bond process yield improvement and monitoring.
• Drive for Wire Bond related test QDN investigation and improvement plan.
• Drive for wire bond related improvement projects.
• Hand-sake with NPI team on new technology / product / wire bond methodology transfer to mass production.
• Liaise and work with equipment team on equipment related improvement and new machine qualification.
• Project management in project related to wire bond yield improvement, cost saving and process efficiency.

REQUIRED:

• Min Bachelor or higher Engineering degree (Chemical engineering, Mechanical Engineering, data science engineering & etc)
• Min 2 years of working experience in Semiconductor Process development & sustaining.
• Wire bond process engineering/ NPI engineering background.
• Strong communication and coordination skills to work effectively with a cross functional team.
• Knowledge in Semiconductor assembly backend processes.

PREFERRED:

• Wire bond process knowledge will be in advance.
• Know well in data automation. 
• Excellent in technical problem solving methodology.

SKILLS:

• Good in reporting (RCA / A3 / OPL).
• Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
• Familiarize with Failure Mode Effects Analysis (FMEA), Control Plan, Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Minitab, JMP.
• Good project planning, strong sense of quality and urgency.