jobs in NXP Semiconductors

全职 Packaging Development Engineer 工作, 薪水, NXP Semiconductors Federal Territory 公司招聘中 - Ricebowl

Packaging Development Engineer

Undisclosed

KL City, Federal Territory

分享
保存

工作地点

  • Kuala Lumpur Federal Territory Malaysia

职位描述

岗位职责

Responsibilities

  • Lead, plan, and execute projects related to process assembly development and validation
  • Design, execute, and analyze process related experiments
  • Use software to analyze data including statistical analysis
  • Solve process issues using creative problem solving techniques
  • Create process recipe for packaging development, qualify and transfer for high volume production
  • Set up new specifications and procedures for production
  • Initiate sharing of lesson learnt and best practices among manufacturing sites
  • Lead / participate in Task Force Teams
  • Identify risks and actions for risk mitigation manufacturing operation
  • Lead / support process qualification activities

Requirements

  • Minimum Bachelor’s degree in Engineering or Sciences (or related field). Master or PhD holder is preferred.
  • Good aptitude in statistical data analysis and problem solving skills
  • Must exhibit pro-activeness in leading process characterization work, ability to take on new challenges an embrace changes
  • Basic knowledge of project planning and experience in driving small projects
  • Excellent communication and presentation skills
  • Must demonstrate good initiative, collaboration, and interpersonal skills working with cross functional teams
  • Must be committed to meet process / project deadlines and commitments

More information about NXP in Malaysia...

重要安全守则

申请工作时,切勿提供您的银行或信用卡详细资料。不要转账或完成无关的在线调查问卷。如果您发现可疑内容,请举报此招聘广告。

了解更多