全职 Section Manager, Process Integration Engineering (PIE) 工作, 薪水, Ambition 公司招聘中 - Ricebowl

We are seeking an experienced Section Manager, Process Integration Engineering (PIE) to lead the Process Integration team in driving technology development, yield improvement, process optimization, and manufacturing excellence for wafer fabrication operations. This role will work cross-functionally with Process, Device, Yield Enhancement, Manufacturing, Quality, and R&D teams to ensure robust technology transfer and high-volume manufacturing performance.

Key Responsibilities

• Lead and manage the Process Integration Engineering team to achieve yield, quality, cycle time, and cost targets.
• Drive process integration strategies for technology development, new product introduction (NPI), and high-volume manufacturing.
• Identify yield loss mechanisms through systematic data analysis and develop effective corrective actions.
• Coordinate cross-functional teams to resolve process integration issues and improve overall wafer performance.
• Monitor key process and device parameters to ensure product reliability and manufacturing stability.
• Support technology transfer from R&D to manufacturing and ensure smooth production ramp-up.
• Drive continuous improvement initiatives using statistical analysis, DOE, SPC, FMEA, and root cause analysis methodologies.
• Collaborate closely with Process, Device, Equipment, Quality, Reliability, and Manufacturing teams to optimize fab performance.
• Lead engineering projects focused on productivity improvement, defect reduction, cost optimization, and cycle time reduction.
• Develop engineering talent through coaching, mentoring, performance management, and technical guidance.
• Prepare and present engineering reports, project updates, and yield performance reviews to senior management.

Qualifications

• Bachelor's, Master's, or Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related disciplines.
• 8–15+ years of semiconductor wafer fabrication experience, with substantial experience in Process Integration Engineering (PIE).
• Prior leadership experience managing engineering teams is preferred.
• Strong knowledge of semiconductor manufacturing processes, including Lithography, Etch, Thin Film, Diffusion, CMP, Implant, Wet Cleaning, and Metrology.
• Experience supporting technology development, yield improvement, process optimization, and manufacturing ramp.
• Strong analytical and problem-solving skills with hands-on experience in DOE, SPC, JMP, Minitab, or statistical analysis tools.
• Excellent project management and cross-functional communication skills.
• Strong leadership, coaching, and stakeholder management capabilities.
• Fluent in English; Mandarin is an advantage for collaboration with regional teams.

Preferred Experience

• Experience in advanced technology nodes or specialty technologies.
• Familiarity with high-volume wafer foundry manufacturing environments.
• Experience supporting automotive, industrial, power, or mixed-signal semiconductor products.
• Proven track record of leading yield improvement or technology transfer projects.

If you would like to be considered for this opportunity, please forward a copy of your full CV to *************

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614