Key Responsibilities
- Develop, optimize, and sustain semiconductor manufacturing processes to achieve quality, yield, and productivity targets.
- Analyze process performance and implement corrective and preventive actions.
- Support new product introduction (NPI), process qualification, and production ramp-up.
- Perform process troubleshooting and root cause analysis for quality and production issues.
- Work closely with Production, Equipment, QA, and Manufacturing teams to improve process capability.
- Develop and maintain process documentation, SOPs, FMEA, and Control Plans.
- Drive continuous improvement projects using Lean, Six Sigma, SPC, DOE, and other quality tools.
- Support customer audits and internal quality initiatives.
Preferred Process Experience
Candidates with experience in one or more of the following semiconductor processes are encouraged to apply:
- AOI (Automated Optical Inspection)
- Die Bonder
- Die Attach (DA) & Reconstitution (Recon)
- Plasma Process
- Curing
- Dispensing
- Wire Bonder
- Front of Line (FOL) Assembly Process
Requirements
- Bachelor's Degree in Electronic Engineering, Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Mechatronics, or a related discipline.
- Minimum 2–5 years of experience in semiconductor or electronics manufacturing.
- Hands-on experience with semiconductor assembly and AOI processes.
- Knowledge of process validation, SPC, DOE, PFMEA, and statistical data analysis.
- Strong troubleshooting, analytical, and problem-solving skills.
- Good communication skills and ability to work in a cross-functional team.
- Full Time Position located in Bayan Lepas, Penang.
Job Type: Full-time
Pay: RM5,500.00 - RM7,000.00 per month
Benefits:
- Additional leave
- Dental insurance
- Flexible schedule
- Free parking
- Health insurance
- Maternity leave
- Opportunities for promotion
- Parental leave
- Professional development
Work Location: In person