全职 Staff Engineer, RD Packaging - Module Engineering 工作, 薪水, Ams-OSRAM Asia Pacific Pte. Ltd. 公司招聘中 - Ricebowl

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.
Find out more about us on *************

The CSA division supplies sensors that bridge the gap between the world we live in and the digital world of machines. By converting physical signals - heartbeats, sounds, light waves - into data, we enable robots, cars and other devices to interact with people and improve our world. What drives CSA is a relentless desire to contribute to technology and have a meaningful impact on the world. This business thrives on solving complex problems and partnering with global leaders at the forefront of technological advancement. Our goal: to push the boundaries of sensor technology and empower innovators to make the world smarter, healthier and happier.

Your new responsibilities

• Assist in integrating and optimizing end-to-end manufacturing process to meet product specifications and performance targets
• Monitor process performance, yield trends and key quality indicators
• Supporting root cause analysis and implement corrective actions for process and product-related issues
• Working with process and product development engineers to create process flow and initial equipment list required in projects
• Collaborate with cross-functional teams to resolve product or process-related issues
• Developing and maintaining documentations like FMEA, machine and process buy-off document

Who we are looking for

• Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
• Preferred 3 - 5 years in either R&D, packaging technologies, manufacturing.
• Fresh graduates will be considered.
• Experience in sensor module packaging and/or optical engineering will be an advantage.

Please contact Soi Kim Kee for further information via ************* or +65 () 62402395.