Hands-on investigations of flash memory devices, working directly with advanced lab equipment and collaborating with experienced engineers to uncover the root causes of device failures and drive improvements in products.
Perform detailed electrical analysis to isolate faults in memory devices using tools like oscilloscopes, curve tracers, and in-house testers.
Able to interpret circuit schematics and layouts for defect localization or collaborate with product or design engineers for difficult cases.
Conduct physical analysis using advanced techniques like SEM imaging to visualize and understand failure mechanisms.
Develop and present failure models based on findings
Partner with cross-functional teams – including design, process integration, and test engineering – to improve product reliability, yield, and test coverage.
Help expand lab capabilities by exploring new tools and methods to enhance failure analysis success rate.
REQUIRED:
PhD or MS degree in Electrical Engineering, Materials Science & Engineering, Physics, or related fields
Strong foundation in semiconductor device physics and electronic circuits
Enthusiasm for hands-on lab work and problem-solving
Prior internship or research experience with semiconductor technologies is a plus
PREFERRED:
Excellent writing, editing, communication and presentation skills