全职 [Photonics] Senior Process Integration Engineer 工作, 薪水, Ambition 公司招聘中 - Ricebowl

Role Overview

Lead process integration activities for advanced semiconductor products from development through production. This role is responsible for driving new product introduction (NPI), optimizing manufacturing processes, improving yield and reliability, and working closely with foundry, OSAT, and cross-functional engineering teams to ensure successful product commercialization.

Key Responsibilities

• Lead process integration and NPI activities for advanced semiconductor products.
• Develop and optimize process integration flows to improve performance, yield, manufacturability, and reliability.
• Collaborate with Design, Packaging, Product, Reliability, and Operations teams throughout the product lifecycle.
• Drive technology transfer and manufacturing readiness with foundry and OSAT partners.
• Design and execute DOE, analyze process data, and implement process improvements.
• Investigate process and yield issues, perform root cause analysis, and drive corrective actions.
• Define process specifications, qualification plans, FMEA, and engineering documentation.
• Support advanced packaging technologies such as Chiplet, TSV, wafer-level packaging, and heterogeneous integration.
• Work with external manufacturing partners to ensure stable production and continuous process improvement.
• Provide technical leadership and mentor junior engineers when required.

Ideal Requirements

• Bachelor's degree or above in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related discipline.
• Minimum 5 years of experience in semiconductor Process Integration, Product Engineering, Technology Development, or Advanced Packaging.
• Strong understanding of semiconductor manufacturing processes, yield improvement, reliability, and process characterization.
• Experience working with foundries, OSATs, or outsourced semiconductor manufacturing partners.
• Hands-on experience with DOE, SPC, FMEA, and data analysis for process optimization.
• Knowledge of advanced packaging technologies (e.g., Chiplet, TSV, WLP, Flip Chip, or Heterogeneous Integration) is highly preferred.
• Experience in photonics, optical communication, LiDAR, compound semiconductors, or sensor technologies is an advantage.
• Strong analytical, communication, and stakeholder management skills with the ability to work effectively in a cross-functional environment.

If you would like to be considered for this opportunity, please forward a copy of your full CV to *************

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

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