jobs in ACCTON TECHNOLOGY SG PTE. LTD.

全职 Manufacturing Program Manager 工作, 薪水 up to SGD 9,000, ACCTON TECHNOLOGY SG PTE. LTD. 公司招聘中 - Ricebowl

Manufacturing Program Manager

ACCTON TECHNOLOGY SG PTE. LTD.

SGD7,500 - SGD9,000 每月

West

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工作地点

  • West Singapore

职位描述

岗位职责

Manufacturing Program Manager

Position Summary

TheManufacturing (MFG) Program Manager is responsible for leading cross-functionalexecution of manufacturing programs for optical transceiver products from NewProduct Introduction (NPI) through ramp and mass production. This role ensuresalignment of schedule, cost, yield, and quality objectives by drivingcoordination across Engineering, Manufacturing, Test, Quality, and Supply Chainteams.

Key Responsibilities

Program Planning & Execution

·       Leadend-to-end program execution:

·    EVT→ DVT → PVT → MP

·       Defineand manage:

·    Programschedule

·    Milestonesand deliverables

·   Resource allocation

Cross-functional Coordination

·       Drivealignment across:

·    ProductEngineering

·    Manufacturing/ Process Engineering

·    TestEngineering

·    Qualityand Supply Chain

  • Ensure timely issue resolution and decision-making

Risk & Issue Management

·       Identifyand track:

·    Technicalrisks

·    Manufacturingreadiness gaps

·    Yieldand quality risks

  • Drive mitigation plans and on-time closure

Manufacturing Readiness

·       Ensurereadiness for:

·    Linesetup

·    Capacity

·    Processstability

·       Track:

·    Yieldramp progress

·    Cycletime

·    Throughputreadiness

Qualifications

Education

  • Bachelor’s degree or above in Engineering (Mechanical, Electrical, Manufacturing, or related discipline)

Experience

·       8+years of experience in electronics, semiconductor, or optical modulemanufacturing

·       5+years in program or project management in high-volume manufacturingenvironments

  • Experience in electronics or optical module manufacturing preferred

Technical Skills

·       Strongunderstanding of optical transceiver manufacturing processes:

·    SMT/ PCBA

·    DieBond (DB), Wire Bond (WB), Active Alignment (AA)

·    Assembly,Test, Burn-in

·       Familiaritywith:

·    Productdevelopment lifecycle and design transfer

·    Yieldramp challenges and manufacturing readiness

·       Experiencewith program management tools:

·    Riskregister, Gantt, milestone tracking

·       Understandingof:

·    Costmodeling and BOM structure

·   Capacity planning and line readiness

Soft Skills

·       Strongleadership and cross-functional coordination

·       Excellentstakeholder communication (internal & customer-facing)

·       Decision-makingunder uncertainty and time pressure

重要安全守则

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