全职 Hardware Development Engineer 工作, 薪水, UST Pulau Pinang 公司招聘中 - Ricebowl

Responsibilities:

• Responsible for Test hardware (Loadboard, Probe card, Test Socket, Probe Head, Contact pins) specification definition, development, debug, validation and qualification for Sort, and Final Testing (Package) of PSG FPGA products.
• Responsible to enable test capability to meet diverse and critical test requirements e.g. High Speed testing, Loop Back testing, and High Current testing.
• Responsible to develop cost effective and robust test hardware solution that ease the maintenance, and scalable to meet production demand.
• Responsible to gather hardware technical requirements from stakeholder, conceptualization and implementation on actual test hardware.
• Responsible to identify and implement value engineering activities to improve the test stability and robustness as part of continuous improvement process.
• Participate in tester configuration definition, proliferation, and standardization across Intel PSG products.
• Provide technical leadership and tactical support in resolving test hardware issue during first article and engineering evaluation.
• To lead and drive the development of diagnostic tools and software to assist in test hardware debug and troubleshooting.
• Collaborate with worldwide cross-functional teams including designers, software, manufacturing, and product engineering, as to drive cost effective, robust and sustainable test hardware solution.
• Participate in test hardware benchmark initiative to optimize and innovate hardware development process and methodology.

Requirements:

• Candidate must possess at least a BS/MS in Electrical Engineering or equivalent, with 3-5 years of industry experience in IC Design, IC Test, or IC Test Hardware development or equivalent field.
• Sound knowledge in test hardware debugging, troubleshooting, and methodical problem solving techniques.
• Experience in test hardware development for IC testing – wafer or package level.
• Experience in Schematic review, PCB layout review, and Manufacturing file (e.g. gerbers) review.
• Good knowledge on IC packaging, POD (Package outline dimension), and Pin out / map.
• Solid understanding of digital, analog and mixed signal circuits and its fundamental operation.
• Excellent analytical, project management, communication and interpersonal skills.
• Programming Language experience (C, C++, VB, Perl) is added advantage
• Knowledge of ATE, tester instrument and main component functionality is added advantage.