You will own assigned process equipment end-to-end in a high-volume semiconductor fab, with direct accountability for uptime, reliability, and continuous improvement. The role suits an engineer who goes beyond reactive maintenance and drives structured problem-solving at the source.
Responsibilities
- Serve as primary equipment owner for assigned tools, with accountability for OEE, MTBF, and MTTR targets
- Plan and execute preventive maintenance activities in line with OEM recommendations and fab strategy
- Perform complex troubleshooting across electrical, mechanical, vacuum, RF, gas delivery, and software subsystems
- Lead root cause analysis for chronic and high-impact issues using structured methods including 8D, Fishbone, and 5-Why
- Analyse FDC data, SPC charts, tool logs, and metrology data to correlate equipment conditions with process performance
- Work with process engineering to support qualifications, chamber swaps, hardware changes, and recipe releases
- Identify and implement improvement projects targeting uptime, parts lifetime extension, and operating cost reduction
- Provide technical coaching to junior engineers and equipment technicians
Requirements
- Degree in Electrical and Electronics Engineering, Mechanical Engineering, Mechatronics, Materials Science, Chemical Engineering, or a related field
- Minimum 5 years of experience as an Equipment Engineer in a semiconductor fab
- Hands-on experience in one or more of the following process modules: Thin Film Deposition (PVD/CVD) or Etch
- Demonstrated troubleshooting depth across vacuum, RF, gas delivery, or temperature control systems
- Working knowledge of SPC, FMEA, and 8D methodologies applied in a production environment