全职 Principal Engineer Package Technology Development 工作, 薪水, Infineon Technologies Pulau Pinang 公司招聘中 - Ricebowl

Package Design and Development: Design and develop WB BGA, QFP and VQFN package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.

Your Role

Key responsibilities in your new role

• Package Design and Development: Design and develop WB BGA, QFP and VQFN package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
• Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
• Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
• Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned.
• Project Management: Collaborate closely with subcon partners to identify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope.
  
  

Your Profile

Qualifications And Skills To Help You Succeed

• Over 10 years of experience in package development, process development(assembly), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects.
• Good technical knowledge of Back End processes & material knowledge in bumping and laminate packages and interaction to the different functions(eg. design rules, direct materials and processes qualification).
• Good understanding of Automotive quality / reliability requirements and standards.
• Bachelor's or Master's degree in a relevant field, such as:
• Materials Science
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
  
  
  

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