全职 RFSOI Technology Development Integration Staff Engineer 工作, 薪水, United Microelectronics Corporation (UMC) East Region (Singapore) 公司招聘中 - Ricebowl

Job Summary

We are seeking a highly experienced Staff Technology Development Integration Engineer to lead the development and integration of advanced RF-SOI (Radio Frequency Silicon-On-Insulator) semiconductor technologies. This role will drive process integration across modules, enabling high-performance RF devices for applications such as 5G/6G, IoT, and automotive connectivity.

Key Responsibilities

• Lead end-to-end process integration for RF-SOI technology development, from early concept through qualification and production transfer.
• Define and optimize integration schemes involving FEOL, MOL, and BEOL modules for RF device performance (e.g., switches, LNAs, tuners).
• Collaborate closely with device engineering, process module teams (lithography, etch, deposition, implant), and design teams to meet RF performance targets (linearity, insertion loss, isolation).
• Drive yield improvement and defect reduction through systematic failure analysis and data-driven methodologies.
• Develop and execute DOE (Design of Experiments) to understand process interactions and optimize device characteristics.
• Own integration-related technical problem solving, including variability, reliability, and parametric issues.
• Support silicon debug, electrical characterization, and correlation between process parameters and RF performance.
• Lead cross-functional integration reviews and provide technical direction to junior engineers.
• Interface with foundry/manufacturing partners for technology transfer and ramp-up.
• Document and present technical findings to internal stakeholders and leadership.

Required Qualifications

• PhD or Master’s degree in Electrical Engineering, Materials Science, Physics, or related field.
• 8+ years of semiconductor process integration experience, with strong exposure to RF technologies.
• Deep understanding of RF-SOI device physics and integration challenges is preferred.
• Experience with CMOS or SOI process technologies, including integration flows and module interactions.
• Strong analytical skills with hands-on experience in DOE, statistical analysis, and yield learning.
• Proven track record of solving complex integration problems in advanced nodes.
• Familiarity with RF device characterization and key metrics (harmonics, linearity, R_on, C_off, etc.).
• Excellent communication and leadership skills.

Key Competencies

• Technical leadership and ownership
• Cross-functional collaboration
• Data-driven decision making
• Problem-solving under ambiguity
• Innovation in semiconductor technology development

• Impact of the Role

This role is critical in enabling next-generation RF technologies that power modern wireless communication systems. You will directly influence device performance, manufacturability, and time-to-market for cutting-edge semiconductor solutions.