jobs in RF360 SINGAPORE PTE. LTD.

全职 Taping Process Engineer 工作, 薪水 up to SGD 4,600, RF360 SINGAPORE PTE. LTD. Central Region (Singapore) 公司招聘中 - Ricebowl

Taping Process Engineer

RF360 SINGAPORE PTE. LTD.

SGD4,600 - SGD4,600 每月

Central Region (Singapore)

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工作地点

  • 166 KALLANG WAY Central Region (Singapore) Singapore

职位描述

岗位职责

Job Summary:

We are looking for a proactive and technically skilled Process Engineer to support backend wafer level manufacturing operations activities. This role requires hands-on involvement with production tools, troubleshooting equipment, process optimization, and vendor management. The ideal candidate will be responsible for sustaining critical processes, resolving production issues, and driving continuous improvement.

Key Responsibilities:

Process Engineering (Primary responsibility)

  • Lead and sustain backend processes including Tape Expansion, UV Curing and Taping.

  • Perform hands-on troubleshooting of process related issues.

  • Drive continuous improvement initiatives to reduce cycle time, improve yield, and lower operational costs.

  • Drive permanent solutions to resolve chronic process and quality issues.

  • Lead investigation for process quality escalation.

  • Lead process buyoff and performance validation for new machines and technologies.

  • Responsible for preparing the line for internal & external audits and follow-up actions

Project Leadership

  • Lead cross-functional projects involving technology transfer, cost savings, and process enhancement.

  • Coordinate with Technology Development and Process Integration teams for new product release / quality related matters Lynne.

Requirements:

  • Bachelor’s Degree in Mechanical, Manufacturing, or related Engineering discipline.

  • Minimum 2 years of hands-on experience in semiconductor backend packaging specifically Tape Expansion, UV Cure, Taping, Reel-to-Reel processes.

  • Strong knowledge of Wafer level Taping process

  • Proficient in 5-Why Analysis, FMEA, Control Plan, OCAP, SPC, MSA , 8D report and 6 Sigma (Green Belt preferred).

  • Excellent communication and interpersonal skills; able to work with cross-functional teams.

Preferred Skills:

  • Experience with management and controls of Wafer level Taping process

  • Familiarity with Minitab, Excel, Word and PowerPoint.

  • Experience in project management is an advantage.

Others:

  • Ability to work in a fast-paced, dynamic environment and adapt to changing priorities.

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