The Package Innovation organization is responsible for the design of new packaging products and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application.
Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.
As Packaging Materials Engineer your challenge will be to co-develop material technologies and characterize packaging materials in order to understand relationships between packaging materials and product reliability. With your knowledge and experience you will provide Best-in-Class Technology in all aspects – Quality, Performance, Integration and Cost of Ownership, while cooperating with the material suppliers, Package Innovation colleagues, Business Lines, assembly sites and customers on a global scale.
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To drive the creation and implementation of best practice manufacturing vision, strategy, policies, processes and procedures to aid and improve operational performance.
To manage overall cost control on production activity in order to ensure high productivity and minimum of wastage.
To be proactive on improvement streamline the of production process flow for operational effectiveness, manpower management, resolve and mitigate quality issue or all related to productions.
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