SILICON BOX Hiring! Full Time Senior- Designer, Packaging in East Region (Singapore) - Ricebowl

Position Summary

The Senior/ Designer, Packaging is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• With reference to internal design guidelines, work with the internal & external customer to:

- Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.

- Generate test vehicle design and the related PCB design.

- Prepare design risk assessment report.

- Generate reticle and stencil design.

- Generate other schematics or drawing as requested.

• Review, maintenance and update the design guidelines.
• Manage the conversion of internal design into suppliers’ final design.
• Document all the drawing revisions and change records.
• Support audits
• Any other ad-hoc duties as assigned

Requirements

• Bachelor’s Degree in Electrical Engineering or similar discipline
• At least 3 years of hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.
• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.
• Familiar with other design software like Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors.
• Familiar with PCB test board design.
• Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process would be advantageous.